Diamond Wire Cutting Wafer

We offer contract slicing using diamond wire.

Diamond wire cutting wafer.

20 μm 20 μm results subject to change based on process material and cutting orientation parameters cropless ingot process diamond wire. You can request information concerning quantity details and prices by contacting us or filling in the form. 310 μm feed rate. The diamond wire slicing process we employ provides our customers less kerf loss with outstanding finishes to micron level tolerances.

In addition to the supply of diamond wire we can also provide high quality diamond beads with customized sizes or in the following average diameters. Slicingtech serves the needs of companies who require high precision high volume wafer slicing. Along with a wide range of meyer burger wafer slicing systems we now feature the world renowned state of the art meyer burger dw 288 diamond wire slicing systems for hard and brittle materials. 32 n 35 n cut time 180 minutes 150 minutes tv5.

15 μm 15 μm warp. Wafer production places high demands on the technology used while the market demands maximum efficiency from manufacturers. Our lead times are short and we can accommodate requirements from r d to production quantities. The new environmentally friendly diamond wire technology for wire saws doubles the cutting speed of saws.

15 μm 15 μm bow. Diamond wire saw is an environmentalhigh efficient safe cutting tool which is a specially designed for cutting and separating crystal material magnetic material or sapphire wafer. Siemens offers optimized automation concepts for high performance ingot cutting machines. The working principle is that under a certain tension the wire saw grinds and cuts the object removes the debris and heat with cooling water and finally divides.

It is important that the adhesive does not contaminate the debonding bath and the silicon but adheres to the carrier. Logitech s model 15 diamond wire disc saw is a compact saw ideal for the precision slicing and dicing of materials from the most delicate crystals to the hardest ceramics. 200 μm 250 μm wire speed. Abrasive slurry saw wire with abrasive slurry diamond wire without abrasive slurry silicon.

Afterwards the wafers can be separated from the carrier plate without any residues. Along with a wide range of meyer burger slicing systems we now feature the world renowned state of the art meyer burger dw 288 and meyer burger dw 265 diamond wire slicing systems for hard and brittle. Wire saw contract cutting and wafer slicing slicingtech serves the needs of companies who require high precision high volume wafer slicing. 12 m sec 12 m sec wire tension.